Is the full name of CSP Chip Scale Package, Chinese mean Chip Scale packaging device, refers to the size is smaller than the Chip size 1.2 times the packaging device, samsung shipments of LM - 131 - a biggest Chip size is 0.78 * 0.78 mm, Package size is 1.42 * 1.42, and the current mainstream Chip vendors strictly packaging size do not meet this requirement, so called the CSP is rigorous. Without encapsulation chip called from Taiwan introduced, because the chip without the traditional solid crystal and welding line the encapsulation process, so commonly known as encapsulation chip.

CSP without encapsulation structure of the three mainstream chip

The first camp: made of silica gel phosphors, five surface light, high light efficiency, but the color temperature around the top and consistency control is poorer. The east son photoelectron CSP is the primarily. CSP

Around the second camp: using titanium dioxide protection and fluorescent membrane, only at the top of a shiny surface, consistency and directivity of light is very good, but the light around the lost output, photosynthetic efficiency will be low. Samsung mainly adopts this technology is given priority to, but also in the development of bdo, the first technique. East son photoelectron, bdo, technology products. CSP

Complete coverage of the third camp: using fluorescent membrane, add transparent silicone molding, fixed and five surface light, high light efficiency, quality of light is a bit poor, mainly is the philips cixin using.

CSP

Here it is worth mentioning that in addition, there is a self-proclaimed CSP on the market, is with the substrate, although also can do little volume, but not the final form.

Replace the traditional LED three applications

CSP is the earliest use of backlight and flash light, the apple and samsung mobile phone flash is no encapsulation using CSP chip, the samsung and LG slim TV parts using CSP without encapsulation of chip. In the lighting industry, CSP because of small volume, high flexibility, range of application will be more and more widely. At present mainly in three areas:

First, power and high power can be a direct replacement.

Matrix, the second is more than replacement COB, because the lamp bead spacing problem, temporarily can not meet the requirement of the spot, particularly high small Angle to shoot the light. But according to the flintlock Ming Fu Haiyong, head of research and development, this CSP technology still has a chance to replace the COB, good solve the cause of imaging.

Matrix arrangement